Special solutions for fan/heat sink combinations
Axial fan ensures failsafe cooling of inverters in photovoltaic systems
Axial fan ensures failsafe cooling of inverters in photovoltaic systems
Chipcooler HZ25B for inspection cameras
Inspection cameras are used to inspect and analyse damage in pipes. The fan that has been used in the past for this purpose was inadequate and could no longer provide optimum cooling of the electronics. The extremely low overall height presented a challenge.
Axial fan MFB50E for cooling photovoltaic panels
The shift to renewable energy sources without the use of photovoltaics is inconceivable and simply because photovoltaics represent a sustainable and environmental friendly method of converting solar energy into electricity. To ensure that the inverter has a long service life, it must have an appropriate thermal management. SEPA EUROPE’s popular axial fan MFB50E is ideal for this purpose.
Radial fans for plug-in card
In the case of this application, the permitted temperature range may not be exceeded. What is required is an efficient cooling concept for cooling the FPGAs that process the video signals.
Cooling solutions for your small collection of components
Processor cooling is undoubtedly the most renowned application for chip coolers. The size of the heat sink and the mounted fan are designed to appropriately suit the power dissipation of the CPU, the dimensions of the processor surface and the available height.
Overheating of single board computers
They are small, compact and have astonishing application possibilities – the single board computers.
Slimline and efficient cooling solutions with fans and heat sinks
In many applications with high-performance FPGAs power dissipation occurs (>30W) but yet there is very little space above the chip to ensure adequate cooling. The existing space must therefore be used as effectively as possible.
Chip Cooler – According to the wishes of the customer
In cooperation with the heat sink manufacturer Alutronic, the cooling specialist SEPA EUROPE presents a completely new generation of pin-fin heat sinks with up to 40% higher thermal conductivity in comparison to customary heat sinks.
Extremely flat radial fan HY60Q cools efficiently
In the case of this application, the permitted temperature range may not be exceeded. What is required, is an efficient cooling concept for cooling the FPGAs that process the video signals.
40 mm frameless fan for integrating in heat sink
SEPA EUROPE offers a 40 mm frameless fan especially for embedded systems. It is 10 mm high and provides a compact solution for chip cooling when used in combination with the appropriate heat sink.