Overheating of single board computers

Overheating of single board computers

They are small, compact and have astonishing application possibilities – the single board computers (SBC).

Since 2019 they have become widely known. They are small, compact and have an astonishing wide field of application. The PCs of credit card size are highly valued not only for their high flexibility and performance but also for their affordability and energy-efficient operation. Inventors, programmers, makers and educational institutions throughout the world are impressed by this development.

However, what happens when a single board computer overheats?

With more complex applications, higher ambient temperatures or unfavourable installations, the temperature of the CPU increases. The processor then automatically reduces its clock speed to lower the temperature. Whilst this is a sensible self-protection mechanism for the hardware, it can cause problems for the application. The result is reduced performance, longer response times or unstable behaviour during computationally intensive processes. In industrial applications, this can be particularly critical when data needs to be processed in real time or control tasks must run reliably. If the temperature continues to rise, this can lead to system crashes or, in the worst case, permanent damage.

Active coolers can provide a reliable remedy

Chipkühler HZ25B

An active cooler is a combination of a heat sink and an integrated or external fan. The heat sink absorbs heat directly from the heat source, whilst the fan provides a targeted airflow. Heat is therefore dissipated much more efficiently than with purely passive cooling.

Active cooling reduces the temperature

A practical example shows the effect very clearly: following the installation of the HZ25B active cooler from SEPA EUROPE, the temperature of a single-board computer was reduced from 80 °C to 60 °C. As a result, the risk of thermal throttling was reduced and system stability was significantly improved.

The active cooler HZ25B was developed by SEPA EUROPE and is a smart combination of a heat sink and a mini fan. The heat sink is made from high-purity aluminium and has a convincing low thermal resistance. The integrated mini fan MF17B is also equipped with a special, long-lasting MagFix® sleeve bearing that is designed for operating temperatures of up to 80°C. Thanks to its extremely flat design, the cooler is particularly suitable for applications where space is limited.

Plan thermal management from the start

Thermal management should not be considered at the end of the development process. If cooling is considered too late, the available installation space, airflow paths, and mounting points are often already fixed. Retrofitted solutions then tend to be more complex, less efficient, or mechanically harder to implement. It therefore makes sense to define the thermal requirements as early as the concept phase. These include the maximum power dissipation, the ambient temperature, the mounting orientation, the housing design, the permissible surface temperature, and the operating time. Load profiles also matter: Does the single-board computer run continuously under high computing load or do performance peaks occur only briefly?

The specialists at SEPA EUROPE will be glad to assist you in selecting the right cooling solution.