Chipcooler HXB65 with high

thermal conductivity

The HXB65 chipcooler was developed in cooperation with the heat sink manufacturer Alutronic and comprises a new-generation Powerbloc heat sink and the HFB44B axial fan from SEPA EUROPE.

The heat sink is made from pure aluminium and thus has an exceptionally high thermal conductivity. In comparison to extruded heat sinks, the thermal conductivity is 30% higher, in comparison to die-cast heat sinks it is even 40% higher. The cooling pins are manufactured by cold forging. The low-waste manufacturing method is simple and economical. In addition to standard sizes, special shapes can be realized at predictable tool costs, e.g. the base shape can be square or produced according to the customer’s requirements. The maximum size of the base plate is 200×200 mm, with a minimum base thickness of 1mm (flatness ≤ 0.1mm). The maximum possible pin height is 300 mm and the smallest possible pin diameter is ≥1 mm. The Kühligel is available in both blank aluminium or anodized in colour. Special requests can be realized by mechanical processing.

Double-sided adhesive heat conduction pads (TCT) or thermally conductive adhesive (HERNON 746) can be used for mounting. Other mounting options are available on request. The effectivity of the Kühligel is increased significantly by screw mounting the fan. With the new generation of heat sinks, special screws are used to mount the fans without involving expensive mechanical processing. The applied thread-locking fluid fulfils two tasks: it serves as a lubricant when screwing in the screws and secures any possible chips from falling out. If the height is limited, the fan can be lowered or attached at the side.