Technical infos
In comparison to active (HXB50E05) and passive heat sinks with identical thermal resistance however the heat sink has 5x the volume and weight compared to HXB50E05.
About 30 years ago, „fanless“ was a popular slogan considering the frequently experienced poor quality of small fans. Thanks to the enormous technological progress made in the production of fans, this is nowadays no longer a quality characteristic. This is the case in particular when renouncing on forced cooling can only be achieved by using larger, heavier and more expensive heat sinks.
The statistical service life expectancy (MTBF) of modern fans today is min. 400000h (MTBF) at an ambient temperature of 40°C. Based on a typical service life of an electronic device of approx. 8 years, the service life expectancy of a fan during continuous operation and constant high ambient temperature is actually 4 times as high. There is virtually no reason for renouncing on a fan for modern cooling concepts particularly as the freedom of design is exceptionally high with regard to active cooling and the costs involved can thus be reduced.
Whereas the use of fans for control cabinet cooling is a matter of course and standard fans are widely employed for this purpose, the active cooling of small devices is far more complex. As many problems and the requests of our customers with regard to design, technical and optical details must often be given consideration, their use cannot be limited to just a few standard sizes.
Over the last years, SEPA EUROPE has increased its range for the cooling of electronic components in embedded systems. Environmental requirements were also taken into account as it was possible not only to significantly reduce the power consumption with equivalent or improved effect but also to decisively reduce the use of raw materials. As far as small devices are concerned, the problem is usually not the dissipation of heat generated by all components but the cooling of the „hot spots“. Passive cooling requires approx. 5 times more heat sink volume than cooling supported by a fan and can hardly be accommodated in the space that is available for this purpose. Thanks to modern active cooling, the devices can be smaller, lighter and cheaper without experiencing quality cutbacks.
This is possible due to the creation of a number of new, modified axial, radial and
RaAxial fans and new specially designed heat sinks and accessories. In the meantime many of these new components have become standardized and are available from stock but experience shows that
customized versions are often unavoidable.
