Chip Cooler HFB44B cools with a strikingly low thermal resistance

Task:

In order to avoid damaging the chip, the FPGA chip may not exceed a pre-defined maximum temperature in all permitted ambient temperatures and operating states.

Solution:

The chip cooler HFB44B by SEPA EUROPE with ball bearings, in the dimensions 44x44x7.5mm. It cools the used FPGA with a strikingly low thermal resistance of 2.4K/W with the aid of the integrated aluminium die-cast aluminium heat sink. Not only a long service life but also efficient and quiet operation are a matter of course at SEPA EUROPE and have in this case convinced the customer yet again.