What is a chipcooler anyway?
A chip cooler is a special cooling device for the targeted dissipation of heat from electronic components, e.g. in processors, graphic chips, FPGAs or voltage regulators. These components generate considerable amounts of heat during operation which can result in thermal overloading, loss of performance or premature failure if they are not appropriately cooled. To ensure the functional safety, service life and performance of electronic systems, reliable and efficient cooling is therefore imperative.
Chip coolers typically comprise a thermally conductive aluminium heat sink which absorbs the heat from the component and dissipates it into the ambient air. SEPA EUROPE uses active chip coolers, e.g. compact fan/heat sink combinations where the fan is directly integrated on or into the heat sink to further increase the cooling performance. This lightweight construction enables a high thermal performance where space is limited making it ideal for use in industrial applications, embedded or medical technology.
Thanks to the long years of experience and precise coordination between the fan characteristics, heat sink geometry and thermal design, SEPA EUROPE’s chip coolers boast an optimum balance of efficiency, smooth running and service life even under difficult thermal conditions.
SEPA EUROPE has a large selection of chip coolers.
HZ30B chip cooler – maximum cooling capacity, minimum overall height
The HZ30B chip cooler is the response to increasing demands for embedded computing cooling. Its low weight, flat design and easy mounting set standards without compromising the cooling capacity.
The HZ30B active cooler is an innovative solution as the high-performance MF17B05 RaAxial fan sits flush in an aluminium pinbloc heat sink instead of sitting on the surface. This type of construction enables a remarkably low overall height of only 8 mm so that the chip cooler finds sufficient space even in the most compact device. What’s more, the cooling capacity speaks for itself as the pins are offset so that the air flow is more effective and the thermal resistance of a mere 4.7 K/W is impressive.
Even when it comes to weight, the active cooler sets standards. Its weight of only 11 g makes it ideal for systems where every gram counts and of equal importance it is extremely quiet. In an environment where low-noise operation is significant, it is highly recommendable.
The chip cooler is easy and quick to mount without drilling. We recommend using SEPA EUROPE’s thermally conductive adhesive foil TCT. This foil has an effective thermal contact and can thus contribute to optimizing the cooling capacity.
The integrated mini fan MF17B05 is equipped with a special, highly durable MagFix® sleeve bearing that is designed for operating temperatures of up to 80°C. It is operated with a voltage of 5VDC whereby it consumes as little as 0.3 W. It has a lifespan of 400.000 hours. If necessary, the fan can also be equipped with a tacho output for monitoring the function. The fan and heat sink are also available separately.
Topline AI chip cooling – powerful, low noise and efficient
The HZ100-65 was specially developed for the low noise cooling of both powerful processors and the latest generation of AI chips. Thanks to its flat construction and its flexible adaptability to the desired size, it provides an ideal solution for a variety of industrial applications, e.g. processor cooling, IPCs and AI chips.
The convincing compact dimensions of 100 x 65 x 15 mm and a thermal resistance of only 1.3 K/W are its key features and enable efficient heat dissipation even when the processors in IPCs or AI applications are subject to intensive use. The chip cooler is equipped with the extremely reliable radial fan PLB05710B12H that is based on long-life ball bearings and operates in a wide temperature range of -10°C to +70°C.
A key characteristic of the HZ100-65 however, is the optimized blade design that significantly reduces turbulence. As a consequence the fan performance is increased considerably and the noise level reduced to a mere 20 dB thus making it particularly attractive for applications that are sensitive to noise.
HXB100 chip cooler simultaneously cools several components
The new chip cooler was specially developed to meet the cooling requirements of processors. The new HXB100 chip cooler was designed to enable the cooling of several components simultaneously. This saves both space and costs!
The innovative chip cooler has an astonishingly light and compact construction. It measures a mere 100 x 75 x 13 mm and with its weight of only 100 g it is ideally suitable for use in portable devices. The heat sink was made of pure aluminium in the modern impact extrusion process and has a black oxide coating which considerably increases the heat output. The milled underside ensures that all hot spots are reached and disturbing components omitted. The result is a clean and compact solution!
Thanks to its robust ball bearings the fan boasts a service life of 350.000 h (MTBF at 40°C) and is thus ideally suitable for fail-safe cooling. The chip cooler can be supplied already assembled enabling safe and simple connection to your application. Solder connections or spring clips are no longer required.
Cool your power semiconductor reliably with the compact HZ210 active heat sink
Developing engineers are faced with a challenge when it comes to the choice of a suitable cooling concept for power electronics. This is in particular the case with flat housings where corresponding know-how is required. Thought should be given to this issue already during the concept phase as it may prove difficult to solve this problem if there is very little space for dissipating heat. SEPA EUROPE has developed a smart solution for such requirements, namely the HZ210 – an in-house development that is available in different dimensions.
SEPA EUROPE has developed the new high performance active heat sink HZ210 using the powerful LY60B radial fan. The case study achieved an impressively low thermal resistance of 0.5K/W during laboratory testing. With an overall height of a mere 25 mm this opens up new possibilities for developers to enable the cooling of power components in flat housings.
In the event that a temperature increase of 40K is allowed, 80W power loss can be reliably dissipated. The cooling system comprising SEPA blower, extruded heat sink and cover plate keeps the noise at a comfortably low level. The microphone recorded no more than 34dB(A) in the anechoic chamber.
The fan is available in 5V and 12V versions and has a service life of 210000 h (MTBF) at 40°C thanks to its reliable MagFix© sleeve bearing.
Power chipcooler HZB50B with a thermal resistance of merely 1.4 K/W
Increasing demands on the performance of electronic devices for the cooling of electronic components have over the past years become a challenge. SEPA EUROPE recently developed the HZB50B12 to meet the high demands of the users. The highly durable chip cooler HZB50B12 with its low thermal resistance of only 1.4 K/W is also suitable for both powerful processors and FPGAs.
It is noticeable at first glance that the HZB50B has a very light and compact construction. It measures merely 50 x 50 x 11.5 mm and weighs only 39 g which renders it suitable for low installation heights. The heat sink was produced from pure aluminium by modern impact extrusion which means that large quantities can be manufactured cost-effectively.
Thanks to its robust ball bearing system, it has a service life of 350.000 h (at 40°C) and is thus particularly suitable for failsafe cooling. The brass push pins ensure easy attachment. The PCB only requires preparing with the corresponding holes and reinforcements. The compression springs provide an ideal thermal transfer from the semiconductor to the heat sink.
The innovative chip cooler HZB50B is available with 5 and 12 V and can also be supplied on request with pre-assembled adhesive pads.
Cooling with the HX40P chip cooler
Active cooling is an indispensable instrument in ensuring e.g. the stability and performance of optoelectronic devices. It has distinct advantages over passive cooling solutions, in particular with regard to applications that require precise temperature control. Despite the challenges that accompany its implementation, the advantages outweigh by far. They contribute not only to protecting the sensitive electronics but also to maintaining the optical precision. In the dynamic world of optoelectronics, active cooling remains a key element for technical progress.
The HX40P chip cooler was developed for optoelectronic devices. This highly efficient cooling system has a thermal resistance of a mere 1.3 K/W and is approx. 25 % more efficient than comparable chip coolers on the market. With its dimensions of only 40x40x20 mm it is convincingly compact.
With the distinctive cut in the rotor blades a significantly lower noise level is achieved without affecting the air performance. The HX40P chip cooler is equipped with the highly durable MagFix sleeve bearing and has a service life expectancy of 210000 hours (MTBF) at 40°C.
A more variable, smart chip cooler on the basis of an ultra-flat radial fan
SEPA EUROPE has developed a powerful active cooler specially for compact designs. It is as small as a matchbox and has a thermal resistance of a mere 2.5 K/W. The ultra-flat radial fan can be combined with varying heat sinks for customized solutions.
Chip cooling with the aid of heat sinks usually requires a lot of space and is not only heavy but also expensive. The specialists at SEPA EUROPE have developed a chip cooler with minimum space requirements for compact designs. The core component of the compact cooler is the ultra-flat blower HY40H that is combined with a Kühligel® of pure aluminium. The special feature of the new cooling solution is its variability which means that the size and shape of the heat sink can be freely chosen. Users can thus assemble the cooler to optimally fulfil their requirements.
With a thermal resistance of a mere 2.5 K/W, the new chip cooler withstands a power dissipation of up to 15 W and in doing so guarantees the operational safety of the entire embedded system. The blower is equipped with the highly durable Magfix® sleeve bearing and has an impressive service life expectancy of von 210 000 h (MTBF) at 40 °C. Thanks to the PWM input combined with the tacho output the speed can be both controlled and monitored.
The lightweight compact cooling unit is easy to attach using the double-sided adhesive thermal conductive foil TCT or the thermally conductive two-component adhesive HERNON 746. Both are available from SEPA EUROPE’s wide product range.
Compact chip cooling with a long service life
40 mm frameless fan for integrating in heat sink
SEPA EUROPE offers a 40 mm frameless fan especially for embedded systems. It is 10 mm high and provides a compact solution for chip cooling when used in combination with the appropriate heat sink.
In addition to the 50 mm frameless fan which is already on the market, the new round 40 mm fan is also a much sought-after model for embedded systems. This is because many standard cooling solutions in this business sector are based on the 40 x 10 mm fan. Strictly speaking, the 40 mm fan has a rotor diameter of 37 mm. The version offered by SEPA EUROPE is equipped with two ball bearings and can boast a remarkable service life of 350.000 h at a temperature of 40°C.
In addition to an impulse output for speed monitoring, it also has a PWM input for speed setting in the range of approx. 35 – 100% of the nominal speed. In conjunction with the power block pin-fin heat sink, this virtually silent fan with 22 dB(A) is also available ready for connection.
Comparison of active and passive heat
sinks with the same thermal resistance
Whereas the use of fans for control cabinet cooling is a matter of course and standard fans are widely employed for this purpose, the active cooling of small devices is far more complex. As many problems and the requests of our customers with regard to design, technical and optical details must often be given consideration, their use cannot be limited to just a few standard sizes.
Over the last years, SEPA EUROPE has increased its range for the cooling of electronic components in embedded systems. Environmental requirements were also taken into account as it was possible not only to significantly reduce the power consumption with equivalent or improved effect but also to decisively reduce the use of raw materials.
As far as small devices are concerned, the problem is usually not the dissipation of heat generated by all components but the cooling of the „hot spots“.
Passive cooling requires approx. 5 times more heat sink volume than cooling supported by a fan and can hardly be accommodated in the space that is available for this purpose. Thanks to modern active cooling, the devices can be smaller, lighter and cheaper without experiencing quality cutbacks.
This is possible due to the creation of a number of new, modified axial, radial and RaAxial fans and new specially designed heat sinks and accessories. In the meantime many of these new components have become standardized and are available from stock but experience shows that customized versions are often unavoidable.