Topline AI chip cooling with the powerful, low noise and efficient HZ100-65

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Topline AI chip cooling with the powerful, low noise and efficient HZ100-65
Chipkühler HZ100-65 SEPA EUROPE

Topline AI chip cooling with the powerful, low noise and efficient HZ100-65 chip cooler

The HZ100-65 was specially developed for the low noise cooling of both powerful processors and the latest generation of AI chips. Thanks to its flat construction and its flexible adaptability to the desired size, it provides an ideal solution for a variety of industrial applications, e.g. processor cooling, IPCs and AI chips.

The convincing compact dimensions of 100 x 65 x 15 mm and a thermal resistance of only 1.3 K/W are its key features and enable efficient heat dissipation even when the processors in IPCs or AI applications are subject to intensive use. The chip cooler is equipped with the extremely reliable radial fan PLB05710B12H that is based on long-life ball bearings and operates in a wide temperature range of -10°C to +70°C.

A key characteristic of the HZ100-65 however, is the optimized blade design that significantly reduces turbulence. As a consequence the fan performance is increased considerably and the noise level reduced to a mere 20 dB thus making it particularly attractive for applications that are sensitive to noise.

The chip cooler with an operating time of 350000 hours at 40°C (MTBF) is ideally suited for continuous use in industrial applications. It is equipped with a tacho output for speed monitoring and a PWM input for accurately controlling the fan speed. These features allow the cooling performance to be adapted to the respective requirements of the system.

Thanks to its flexible construction, the chip cooler can be adapted to the required size for integrating in different systems. Furthermore, the fan/heat sink combination can be equipped with any connector.