Increasing demands on the performance of electronic devices for the cooling of electronic components have over the past years become a challenge. SEPA EUROPE recently developed the HZB50B12 to meet the high demands of the users. The highly durable chip cooler HZB50B12 with its low thermal resistance of only 1.4 K/W is also suitable for both powerful processors and FPGAs.
It is noticeable at first glance that the HZB50B has a very light and compact construction. It measures merely 50 x 50 x 11.5 mm and weighs only 39 g which renders it suitable for low installation heights. The heat sink was produced from pure aluminium by modern impact extrusion which means that large quantities can be manufactured cost-effectively.
Thanks to its robust ball bearing system, it has a service life of 350.000 h (at 40°C) and is thus particularly suitable for failsafe cooling. The brass push pins ensure easy attachment. The PCB only requires preparing with the corresponding holes and reinforcements. The compression springs provide an ideal thermal transfer from the semiconductor to the heat sink.
The innovative chip cooler HZB50B is available with 5 and 12 V and can also be supplied on request with pre-assembled adhesive pads.