New micro fan RaAxial MF17B05 for VR headsets

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New micro fan RaAxial MF17B05 for VR headsets

Task:

In the described application, the request was for a hotspot cooling that is quiet, lightweight and space-saving. The classical solution comprising heat sink with mounted fan was too big for the case in question.

Solution:

The new chip cooler HZB25-30 by SEPA EUROPE that only became realizable with the new RaAxial fan MF17B05. This new „hybrid“ fan can be used not only as an axial fan but also as a radial fan that is integrated in a heat sink. Embedded in our pin-fin heat sink, this unit provides an effective and compact complete solution. The air is suctioned in axially from above and blown out radially at the side via the heat sink pins that are heated by the application. Thus the heat that is otherwise trapped due to the limited space is effectively dissipated.