Design freedom through additive manufacturing – chip cooler with 30 percent more cooling capacity
Finally, no more reliance on standards!
Sepa Europe and APWORKS cooperate in the form of a joint project. The goal: more cooling capacity per volume. The result speaks for itself. Close cooperation means that customized cooling solutions can now be offered to a wide range of customers.
The HXB series chip cooler from Sepa Europe, a compact fan-heatsink combination, consists of a pin heatsink (cooling element) and a matching attached fan. For many applications, this attractively priced combination is ideal and also delivers sufficient cooling power. But isn’t there more to it? The development engineers at Sepa Europe asked themselves this question. That was the birth of the 3DQler.