Chip Cooler – Effective cooling of embedded systems

To prevent CPU overheating, high-performance embedded applications must be equipped with effective thermal management. A laboratory study by the cooling specialist

Sepa Europe has shown that a temperature reduction of almost 20 K can be achieved with active chip cooling compared to operation with a passive cooling solution.

Embedded components are becoming ever smaller, more compact and more powerful. However, high computing power is always accompanied by high heat generation. To ensure the functionality and longevity of the entire system, efficient heat dissipation must be provided at the hotspot.