Inspired by customer inquiries, SEPA EUROPE has developed a new, modular assembly for the efficient cooling of chips. The core component is a SEPA axial fan that is mounted on a 40 mm pure aluminium heat sink – a so-called Kühligel®.  It is equipped with a finger guard and a double-sided adhesive heat pad for screwless mounting on the housing or inside the device.

Thanks to the compact design, the light weight and the screwless mounting, this assembly enables accurate positioning and thus effective cooling of the hot spot. The chip cooler HXB40FGK is equipped with a high precision ball bearing and can be used at ambient temperatures between -10 and +85 °C thus opening up a wide range of application possibilities. A further advantage is the long service life of the fan with 350 000 h (MTBF) at 40°C.

The chip cooler assembly HXB40FGK is supplied as a standard component. It can however, be customized. Parameters, e.g. size, tacho output, PWM input, operating voltage or connector assembly, can be specially tailored by SEPA EUROPE to meet the requirements of the customers.