Design active heat sink correctly

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Design active heat sink correctly
Publ_06

Practical tips for cooling management

SEPA Europe had to solve the task of dissipating the power loss of an FPGA in a customer project. With a fixed board design, a cooling system had to be designed that could reliably dissipate at least 15 W of power loss.

The cooling management expert SEPA Europe was confronted with a customer’s project where an FPGA had to be cooled effectively on an image processing PCI Express card. This was a further development of an ongoing project where the FPGA and the overall board design remained unchanged, but the clock frequency had to be increased. As a result, the power dissipation of the device increased from about 7 W to 15 W.